by Matt Media | Jan 19, 2021 | Uncategorized
LF Hot Air Solder Leveling or LF-HASL is identical to the standard HASL process. However, it does have an obvious difference, i.e., it does no use Tin and Lead Solder. Instead, you will use a Tin and Copper, Tin and Nickel, or Tin, Copper, and Nickel germanium. ...
by Matt Media | Jan 4, 2021 | Articles
PCB surface finishes is a dynamic, demanding, and ever-evolving domain. With all the immersion-based coatings available in the market, printed circuit board manufacturers have produced consistent quality circuit boards. Immersion coated PCB surface finish uses a...
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