Capabilities

• Prototype to Box Level Assemblies
• Surface Mount and mixed technology PCB assembly with capacity of over 14,000 component placements per hour
• Automated SMT Optical Inspection (AOI) of part numbers, solder and polarity
• Solder paste stencil printing, component placement and reflow of two-surface SMT multi-board panels from 1.2” x 2.0” to 13” x 16”
• Extensive mixed technology capability with laminar flow RoHS and Lead wave soldering, precision automated point-to-point selective soldering and skillful experienced hand soldering as required
• Board level and system testing per customer specifications